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| PL IA Features NT HIGH PERFORMANCE TERMINATION NETWORK Miniaturized circuitry and packaging for space reduction Designed for gigabit communication networks CO M *R oH Controlled impedance RoHS compliant* S CAT16-PT2F2 - Concave Chip Array Electrical Characteristics Resistance R1 .............................................100 ohms Tolerance .............................................1% TCR .........................................200ppm/C Temperature Range ...........-55C to +125C Max. Operating Voltage ....................5 VDC Max. Power Resistance ................. .0625W Solderability ......................>95% Coverage Product Dimensions 8 .60 .10 (.024 .004) .45 .10 (.018 .004) 7 6 5 .30 .10 DIA. (.012 .004) .40 .10 (.016 .004) 1.60 .15 (.063 .060) For Standard Values Used in Capacitors, Inductors, and Resistors, click here. DIMENSIONS ARE: MM (INCHES) .80 .10 (.031 .004) 3.20 .15 (.126 .006) .40 .10 (.016 .004) 1 2 3 4 Packaging Specifications 5000 pcs - per 7" reel 4.0 .10 (.157 .004) 1.1 (.043) 1.9 .15 (.075 .006) 2.0 .05 (.079 .002) 13 0.5 DIA. (.512 .020) 60.0 1.0 DIA. (2.36 .039) 8.0 .05 (.138 .012) 21 0.5 (.827 .020) 12.5 2 (.492 .079) 178.0 2.0 (7.008 .080) 3.6 .20 (.142 .008) 3.5 .05 (.138 .002) 4.0 .10 (.158 .004) 1.5 +.10/-0 (.060 +.004/-0) 1.75 .10 (.069 .004) 10.0 1.5 (.394 .059) Derating Curve Rated power in percentage (%) Land Pattern Solder resist 100 80 60 40 20 0 -55 0 70 ( Ambient temperature C) 125 0.7 to 0.9 (.028 to .035) Land Chip resistor array CAT 2.0 to 2.2 (.079 to .087) Schematic 8 7 6 5 0.4 to 0.45 (.016 to .0178) 0.80 (.032) R1 R1 1 2 3 4 REV. 05/06 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex. Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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